S-COAM Program to Give 3D Printing Workshops

Posted on 10/5/21 3:01 PM

The Scholarships Creating Opportunities for Applying Mathematics (S-COAM) project will be offering two 3D Printer workshops lead by Dr. Rick Adkins and Dr. John Chrispell of the Department of Mathematical and Computer Sciences.

Part 1 of the workshop introduces the basics of using 3D printers.  Participants will learn about the parts of a 3D printer, differences in materials, basics of moving from model design to appropriate in-fill and support, and the tools and standards used in creating and exchanging computer files storing 3D information.  Demonstrations of both 3D model creation and printing will be shown using standard software tools.  Workshop participants will have the opportunity to create 3D models that could be printed using standard 3D printers. Part 1 will be held in Stright Hall room 220 from 6:30 - 8:00 PM on Wednesday, October 13.

Part 2 of the workshop will engage participants with a hands-on approach to creating models for 3D printing. Participants will use notebooks to create 3D geometries that can be converted to file types that are acceptable for 3D printing.  The focus of this workshop will be more on the mathematics needed for 3D printing, rather than the creation of complicated 3D printable models.  Part 2 will be held in Stright Hall room 220 from 6:30 - 8:00 PM on Wednesday, October 27.

Since the number of seats in Stright 220 is limited, please register for the workshops using the Qualtrics link.  If you have questions, contact Dr. Yu-Ku Kuo of the Department of Mathematical and Computer Sciences.

The S-COAM project at Indiana University of Pennsylvania is a unique scholarship program. In addition to providing monetary scholarship support, S-COAM creates a network of students that engage in professional development activities to improve career prospects and success in STEM fields.  This project is funded by the National Science Foundation Scholarships in Science, Technology, Engineering, and Mathematics (S STEM) program under Award No. DUE 1742304.