Volker Heydemann, senior scientist at Advantech U.S.,
Inc. will present “Additive Manufacturing of Electronics on the
Microscale Level” on Friday, April 10, 2015, at 2:30 p.m. in Weyandt Hall, room 331.
Advantech U.S. applies Evaporation Printing, an ink-free
additive manufacturing process to produce thin film electronic devices,
circuitry, and fine-line interconnects. The devices are constructed on a wide variety of flexible and rigid
substrates by sequential layer-by-layer vacuum deposition of features in the 3–100 µm size range. The layers
consist of evaporated or sputtered bulk materials (metals, dielectrics,
semiconductors). The device layers are patterned
using precision shadow masks that are aligned with 1 µm precision and
repeatability relative to the substrate and any previously deposited
structures. The Advantech additive manufacturing approach provides a simple, scalable,
cost-effective, ink- and lithography-free process for devices, circuits, and
fine-line conductors in the feature size range between lithography-based
integrated circuit (IC) technology (< 1 µm) and printed circuit
board (PCB) technology (> 50 µm).
Department of Physics