Physics Seminar: Additive Manufacturing of Electronics on the Microscale Level

Posted on 4/6/2015 11:30:58 AM

Volker Heydemann, senior scientist at Advantech U.S., Inc. will present “Additive Manufacturing of Electronics on the Microscale Level” on Friday, April 10, 2015, at 2:30 p.m. in Weyandt Hall, room 331. 

Advantech U.S. applies Evaporation Printing, an ink-free additive manufacturing process to produce thin film electronic devices, circuitry, and fine-line interconnects. The devices are constructed on a wide variety of flexible and rigid substrates by sequential layer-by-layer vacuum deposition of features in the 3–100 µm size range. The layers consist of evaporated or sputtered bulk materials (metals, dielectrics, semiconductors). The device layers are patterned using precision shadow masks that are aligned with 1 µm precision and repeatability relative to the substrate and any previously deposited structures. The Advantech additive manufacturing approach provides a simple, scalable, cost-effective, ink- and lithography-free process for devices, circuits, and fine-line conductors in the feature size range between lithography-based integrated circuit (IC) technology (< 1 µm) and printed circuit board (PCB) technology (> 50 µm). 

Department of Physics